HYBRID SEMINAR IN 13-2-005 AND ZOOM

Abstract:

This tutorial offers an overview of typical SI and PI challenges encountered during high-frequency board layout development. In particular, 3D ElectroMagnetic solvers can be used to optimise PCB transmission line geometries for signal integrity, board-to-connector transitions, and impedance matching. The presentation will be delivered with the software at hand, illustrating the environments best suited for these purposes. Additionally, a power integrity analysis will be presented for a module integrating a wire-bonded high-speed serialiser ASIC.

Zoom details are also in the invitation email.

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